Tag: faradflex

DesignCon 2021 Wrap-Up

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Oak-Mitsui Technologies exhibited DesignCon 2021 at San Jose Convention Center to present FaradFlex and MicroThin. FaradFlex is an embedded capacitance material to improve SI/PI and mitigate EMI.

DesignCon 2021

Oak-Mitsui Technologies will be exhibiting at DesignCon 2021 in Silicon Valley from 8/17 to 8/18 to present MicroThin and FaradFlex. Please join us!!! 🙂

IMS 2021 in Atlanta

Oak-Mitsui Technologies will be exhibiting at IMS 2021 in Atlanta from 6/8 to 6/9 to present MicroThin and FaradFlex. Please join us!!! 🙂  

EMC Europe 2020 Virtual

Yoshi will be presenting a joint-paper titled “Reducing the radiation from PCB cavities with a high-DK dielectric layer” at EMC Europe 2020 Virtual to discuss about EMI from PCB cavity with high Dk and ultra-thin embedded capacitance material for higher frequency application such as 5G or mmWave radar.

Embedded Capacitance Webinar

American Standard Circuits will host a webinar with Oak-Mitsui Technologies to speak about embedded capacitance technology for FaradFlex. If you are considering implementing embedded capacitance material for your design, please join us!!!