TechDream attended EMC Hungary 2025 TechDream attended the EMCH2025 International Conference on Electromagnetic Compatibility in Balatonalmádi, Hungary. The conference consisted of many insightful workshops as well as exhibitions from companies including BOSCH and ThyssenKrupp.
API exhibited at EMV 2025 API (Amber Precision Instruments) exhibited at EMV 2025 in Stuttgart from March 25th to 27th to present SmartScan 350, a table-top EMI scanner and SmartZap, an automated Robotic ESD Gun tester. Thank you to everybody who stopped by our booth! https://youtube.com/watch?v=gtGvoiik3pk?si=BTn2AGh8xfHFSdcz
Our principals, API (Amber Precision Instruments) and Oak-Mitsui Technologies exhibited at DesignCon 2025, held at the Santa Clara Convention Center. API presented their EMI scanner SmartScan, and newly developed SmartScan-Precision for IC EMI scan. Oak-Mitsui presented embedded capacitance material FaradFlex, MicroThin and Low Profile Copper. Thank you to everybody who stopped by our booths!
Oak-Mitsui Technologies presented at IMS 2023 to present an embedded capacitance material called FaradFlex to improve SI/PI and mitigate EMI, ultra thin copper called MicroThin and low-profile copper. Thanks for those who stopped by Oak-Mitsui booth!!! 🙂
Risho exhibited at ECTC 2023 to present new PCB materials such as low-loss/low-Dk/low-Df material, low-CTE and low-modulus material, high thermal conductive material and white-colored material for LED. Thank you for those who stopped by Risho booth!!! 🙂
API (Amber Precision Instruments) exhibited at EMV 2023 in Stuttgart last week to present SmartScan which is an EMC/EMI scanner and SmartZap which is an automated robotic ESD tester. Thanks for those who stopped by API booth!!! 🙂
Risho exhibited at electronica 2022 to present new PCB materials such as low-loss/low-Dk/low-Df material, low-CTE and low-modulus material, high thermal conductive material and white-colored material for LED. Thank you for those who stopped by Risho booth!!! 🙂
Oak-Mitsui Technologies presented at PCB West 2022 to present an embedded capacitance material called FaradFlex to improve SI/PI and mitigate EMI, ultra thin copper called MicroThin and low-profile copper. Thanks for stopping by our booth!!! 🙂
Taiki Kitazawa from NAIST (Nara Institute of Science and Technology) presented a paper titled “Analysis of the PDN Induced Crosstalk Impacts on the High-Speed Signaling in Ultra-Thin and High Permittivity Substrates” at EMC Europe 2022 in Gothenburg last week.Great job and thanks Kitazawa-san for evaluating embedded capacitance material called FaradFlex from Oak-Mitsui Technologies and hope to […]
Oak-Mitsui Technologies will be exhibiting at IPC APEX 2022 at San Diego Convention Center to showcase embedded capacitance material FaradFlex, MicroThin and VSP copper. Please join us!!! 🙂