Oak-Mitsui Technologies presented at IMS 2023 to present an embedded capacitance material called FaradFlex to improve SI/PI and mitigate EMI, ultra thin copper called MicroThin and low-profile copper. Thanks for those who stopped by Oak-Mitsui booth!!! 🙂
Oak-Mitsui Technologies will exhibit at DesignCon 2023 at Santa Clara Convention Center from 1/31-2/2 to present an embedded capacitance material called FaradFlex, Micro-Thin and low-profile copper. Please join us!!! 🙂
Oak-Mitsui Technologies will exhibit at IPC APEX 2023 at San Diego Convention Center from 1/24-26 to present an embedded capacitance material called FaradFlex, Micro-Thin and low-profile copper. Please join us!!! 🙂
Mitsui Kinzoku, CSi Global Alliance and Dassault will host the joint ESD seminar in Tokyo on December 9th. Mitsui Kinzoku will present FaradFlex to improve ESD performance and CSi will present SmartScan to debug ESD issues as well as SmartZap for automated ESD testing. If you have time, please join us!!! 🙂
Oak-Mitsui Technologies will be exhibiting at PCB Carolina 2022 at McKimmon Center in NC State University on 11/9. We will present an embedded capacitance material called FaradFlex, ultra thin copper foil called MicroThin and very low-profile copper. Please stop by our booth if you have time!!! 🙂
Oak-Mitsui Technologies presented at PCB West 2022 to present an embedded capacitance material called FaradFlex to improve SI/PI and mitigate EMI, ultra thin copper called MicroThin and low-profile copper. Thanks for stopping by our booth!!! 🙂
Oak-Mitsui Technologies will exhibit at PCB West 2022 at Santa Clara Convention Center on 10/5 to present an embedded capacitance material called FaradFlex to improve SI/PI and PDN and mitigate EMI. MicroThin and Low-Profile Copper will also be showcased. Please join us if you have time!!! 🙂
Taiki Kitazawa from NAIST (Nara Institute of Science and Technology) presented a paper titled “Analysis of the PDN Induced Crosstalk Impacts on the High-Speed Signaling in Ultra-Thin and High Permittivity Substrates” at EMC Europe 2022 in Gothenburg last week.Great job and thanks Kitazawa-san for evaluating embedded capacitance material called FaradFlex from Oak-Mitsui Technologies and hope to […]
Oak-Mitsui Technologies will be exhibiting at IPC APEX 2022 at San Diego Convention Center to showcase embedded capacitance material FaradFlex, MicroThin and VSP copper. Please join us!!! 🙂
Happy New Year 2022 from TechDream. We carry FaradFlex from Oak-Mitsui Technologies which is an embedded capacitance material, EMIStream from NEC which is an EMI design rule check and plane resonance analysis software, SmartScan from API which is a near-field EMI scanner and PCB materials from RISHO. If you are facing any EMI/SI/PI problems, please […]