Risho exhibited at electronica 2022 to present new PCB materials such as low-loss/low-Dk/low-Df material, low-CTE and low-modulus material, high thermal conductive material and white-colored material for LED. Thank you for those who stopped by Risho booth!!! 🙂
Oak-Mitsui Technologies will be exhibiting at PCB Carolina 2022 at McKimmon Center in NC State University on 11/9. We will present an embedded capacitance material called FaradFlex, ultra thin copper foil called MicroThin and very low-profile copper. Please stop by our booth if you have time!!! 🙂
Oak-Mitsui Technologies presented at PCB West 2022 to present an embedded capacitance material called FaradFlex to improve SI/PI and mitigate EMI, ultra thin copper called MicroThin and low-profile copper. Thanks for stopping by our booth!!! 🙂
Oak-Mitsui Technologies will exhibit at PCB West 2022 at Santa Clara Convention Center on 10/5 to present an embedded capacitance material called FaradFlex to improve SI/PI and PDN and mitigate EMI. MicroThin and Low-Profile Copper will also be showcased. Please join us if you have time!!! 🙂
American Standard Circuits will host a webinar with Oak-Mitsui Technologies to speak about embedded capacitance technology for FaradFlex. If you are considering implementing embedded capacitance material for your design, please join us!!!