TechDream attended EMC Hungary 2025 TechDream attended the EMCH2025 International Conference on Electromagnetic Compatibility in Balatonalmádi, Hungary. The conference consisted of many insightful workshops as well as exhibitions from companies including BOSCH and ThyssenKrupp.
API exhibited at EMV 2025 API (Amber Precision Instruments) exhibited at EMV 2025 in Stuttgart from March 25th to 27th to present SmartScan 350, a table-top EMI scanner and SmartZap, an automated Robotic ESD Gun tester. Thank you to everybody who stopped by our booth! https://youtube.com/watch?v=gtGvoiik3pk?si=BTn2AGh8xfHFSdcz
Our principals, API (Amber Precision Instruments) and Oak-Mitsui Technologies exhibited at DesignCon 2025, held at the Santa Clara Convention Center. API presented their EMI scanner SmartScan, and newly developed SmartScan-Precision for IC EMI scan. Oak-Mitsui presented embedded capacitance material FaradFlex, MicroThin and Low Profile Copper. Thank you to everybody who stopped by our booths!
Oak-Mitsui Technologies presented at IMS 2023 to present an embedded capacitance material called FaradFlex to improve SI/PI and mitigate EMI, ultra thin copper called MicroThin and low-profile copper. Thanks for those who stopped by Oak-Mitsui booth!!! 🙂
Risho exhibited at ECTC 2023 to present new PCB materials such as low-loss/low-Dk/low-Df material, low-CTE and low-modulus material, high thermal conductive material and white-colored material for LED. Thank you for those who stopped by Risho booth!!! 🙂
Risho exhibited at electronica 2022 to present new PCB materials such as low-loss/low-Dk/low-Df material, low-CTE and low-modulus material, high thermal conductive material and white-colored material for LED. Thank you for those who stopped by Risho booth!!! 🙂
Oak-Mitsui Technologies will be exhibiting at PCB Carolina 2022 at McKimmon Center in NC State University on 11/9. We will present an embedded capacitance material called FaradFlex, ultra thin copper foil called MicroThin and very low-profile copper. Please stop by our booth if you have time!!! 🙂
Oak-Mitsui Technologies presented at PCB West 2022 to present an embedded capacitance material called FaradFlex to improve SI/PI and mitigate EMI, ultra thin copper called MicroThin and low-profile copper. Thanks for stopping by our booth!!! 🙂
Oak-Mitsui Technologies will exhibit at PCB West 2022 at Santa Clara Convention Center on 10/5 to present an embedded capacitance material called FaradFlex to improve SI/PI and PDN and mitigate EMI. MicroThin and Low-Profile Copper will also be showcased. Please join us if you have time!!! 🙂
American Standard Circuits will host a webinar with Oak-Mitsui Technologies to speak about embedded capacitance technology for FaradFlex. If you are considering implementing embedded capacitance material for your design, please join us!!!