Our principals, API (Amber Precision Instruments) and Oak-Mitsui Technologies exhibited at DesignCon 2025, held at the Santa Clara Convention Center. API presented their EMI scanner SmartScan, and newly developed SmartScan-Precision for IC EMI scan. Oak-Mitsui presented embedded capacitance material FaradFlex, MicroThin and Low Profile Copper. Thank you to everybody who stopped by our booths!
Oak-Mitsui Technologies presented at IMS 2023 to present an embedded capacitance material called FaradFlex to improve SI/PI and mitigate EMI, ultra thin copper called MicroThin and low-profile copper. Thanks for those who stopped by Oak-Mitsui booth!!! 🙂
Risho exhibited at ECTC 2023 to present new PCB materials such as low-loss/low-Dk/low-Df material, low-CTE and low-modulus material, high thermal conductive material and white-colored material for LED. Thank you for those who stopped by Risho booth!!! 🙂
Oak-Mitsui Technologies will exhibit at DesignCon 2023 at Santa Clara Convention Center from 1/31-2/2 to present an embedded capacitance material called FaradFlex, Micro-Thin and low-profile copper. Please join us!!! 🙂
Risho exhibited at electronica 2022 to present new PCB materials such as low-loss/low-Dk/low-Df material, low-CTE and low-modulus material, high thermal conductive material and white-colored material for LED. Thank you for those who stopped by Risho booth!!! 🙂
Risho will exhibit at electronica 2022 on 11/15-18 to present PCB materials including high thermal conductive materials, low-modulus and low-CTE materials, white-colored materials for LED and low-loss materials. Please join us at booth #B1.235.
Oak-Mitsui Technologies will be exhibiting at PCB Carolina 2022 at McKimmon Center in NC State University on 11/9. We will present an embedded capacitance material called FaradFlex, ultra thin copper foil called MicroThin and very low-profile copper. Please stop by our booth if you have time!!! 🙂
Oak-Mitsui Technologies presented at PCB West 2022 to present an embedded capacitance material called FaradFlex to improve SI/PI and mitigate EMI, ultra thin copper called MicroThin and low-profile copper. Thanks for stopping by our booth!!! 🙂
Oak-Mitsui Technologies will exhibit at PCB West 2022 at Santa Clara Convention Center on 10/5 to present an embedded capacitance material called FaradFlex to improve SI/PI and PDN and mitigate EMI. MicroThin and Low-Profile Copper will also be showcased. Please join us if you have time!!! 🙂
Taiki Kitazawa from NAIST (Nara Institute of Science and Technology) presented a paper titled “Analysis of the PDN Induced Crosstalk Impacts on the High-Speed Signaling in Ultra-Thin and High Permittivity Substrates” at EMC Europe 2022 in Gothenburg last week.Great job and thanks Kitazawa-san for evaluating embedded capacitance material called FaradFlex from Oak-Mitsui Technologies and hope to […]