Oak-Mitsui Technologies will exhibit at IPC APEX 2023 at San Diego Convention Center from 1/24-26 to present an embedded capacitance material called FaradFlex, Micro-Thin and low-profile copper. Please join us!!! 🙂
Oak-Mitsui Technologies presented at PCB West 2022 to present an embedded capacitance material called FaradFlex to improve SI/PI and mitigate EMI, ultra thin copper called MicroThin and low-profile copper. Thanks for stopping by our booth!!! 🙂
Taiki Kitazawa from NAIST (Nara Institute of Science and Technology) presented a paper titled “Analysis of the PDN Induced Crosstalk Impacts on the High-Speed Signaling in Ultra-Thin and High Permittivity Substrates” at EMC Europe 2022 in Gothenburg last week.Great job and thanks Kitazawa-san for evaluating embedded capacitance material called FaradFlex from Oak-Mitsui Technologies and hope to […]
Oak-Mitsui Technologies will be exhibiting at IPC APEX 2022 at San Diego Convention Center to showcase embedded capacitance material FaradFlex, MicroThin and VSP copper. Please join us!!! 🙂
Happy New Year 2022 from TechDream. We carry FaradFlex from Oak-Mitsui Technologies which is an embedded capacitance material, EMIStream from NEC which is an EMI design rule check and plane resonance analysis software, SmartScan from API which is a near-field EMI scanner and PCB materials from RISHO. If you are facing any EMI/SI/PI problems, please […]
Oak-Mitsui Technologies will be exhibiting at PCB West 2021 on 10/6 at Santa Clara Convention Center to showcase FaradFlex, MicroThin and VSP copper. Please join us!!! 🙂
Oak-Mitsui Technologies exhibited DesignCon 2021 at San Jose Convention Center to present FaradFlex and MicroThin. FaradFlex is an embedded capacitance material to improve SI/PI and mitigate EMI.
American Standard Circuits will host a webinar with Oak-Mitsui Technologies to speak about embedded capacitance technology for FaradFlex. If you are considering implementing embedded capacitance material for your design, please join us!!!