Yoshi will be presenting a joint-paper titled "Reducing the radiation from PCB cavities with a high-DK dielectric layer" at EMC Europe 2020 Virtual to discuss about EMI from PCB cavity with high Dk and ultra-thin embedded capacitance material for higher frequency application such as 5G or mmWave radar.
RISHO high thermal conductive materials will be introduced at Aurora Circuits webinar on 9/30. White-colored material, low-modulus material and ultra high thermal conductive material will be introduced. If you have any thermal issues or solder joint crack issues, please join us.