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American Standard Circuits will host a webinar with Oak-Mitsui Technologies to speak about embedded capacitance technology for FaradFlex. If you are considering implementing embedded capacitance material for your design, please join us!!!
Yoshi will be presenting a joint-paper titled "Reducing the radiation from PCB cavities with a high-DK dielectric layer" at EMC Europe 2020 Virtual to discuss about EMI from PCB cavity with high Dk and ultra-thin embedded capacitance material for higher frequency application such as 5G or mmWave radar.
RISHO high thermal conductive materials will be introduced at Aurora Circuits webinar on 9/30. White-colored material, low-modulus material and ultra high thermal conductive material will be introduced. If you have any thermal issues or solder joint crack issues, please join us.
Prof. David Pommerenke from Graz University will speak about near-field EMI scan technology on 1/12 at 7 am PST. If you are interested in near-field EMI scan technology, please join us. https://site.ieee.org/germany-emc/files/2020/12/ieee_german_emc_chapter_technical_teleconference_Pommerenke_v2.pdf
RISHO and Electronic Interconnect will host a joint PCB technology webinar on March 3 to introduce latest PCB materials and technologies. Here is the agenda of the webinar. 9:30 - 9:35 Kick-off from Rhonda 9:35 - 10:05 RISHO (by Yoshi Fukawa, President of TechDream) RISHO corporate profile Ultra low-loss materials for antenna White-colored and high […]
TOYOTech will host a joint webinar with GTS (General Test Systems) for automotive OTA test on March 11.
Oak-Mitsui Technologies will be exhibiting at IMS 2021 in Atlanta from 6/8 to 6/9 to present MicroThin and FaradFlex. Please join us!!! :) https://youtu.be/OsoZZYvjA10
Oak-Mitsui Technologies will be exhibiting at DesignCon 2021 in Silicon Valley from 8/17 to 8/18 to present MicroThin and FaradFlex. Please join us!!! :) https://youtu.be/8dfuqii48FI
