Oak-Mitsui Technologies will exhibit at DesignCon 2023 at Santa Clara Convention Center from 1/31-2/2 to present an embedded capacitance material called FaradFlex, Micro-Thin and low-profile copper. Please join us!!! 🙂
Oak-Mitsui Technologies will exhibit at IPC APEX 2023 at San Diego Convention Center from 1/24-26 to present an embedded capacitance material called FaradFlex, Micro-Thin and low-profile copper. Please join us!!! 🙂
Risho will exhibit at electronica 2022 on 11/15-18 to present PCB materials including high thermal conductive materials, low-modulus and low-CTE materials, white-colored materials for LED and low-loss materials. Please join us at booth #B1.235.
Oak-Mitsui Technologies will be exhibiting at PCB Carolina 2022 at McKimmon Center in NC State University on 11/9. We will present an embedded capacitance material called FaradFlex, ultra thin copper foil called MicroThin and very low-profile copper. Please stop by our booth if you have time!!! 🙂
Oak-Mitsui Technologies will exhibit at PCB West 2022 at Santa Clara Convention Center on 10/5 to present an embedded capacitance material called FaradFlex to improve SI/PI and PDN and mitigate EMI. MicroThin and Low-Profile Copper will also be showcased. Please join us if you have time!!! 🙂
Happy New Year 2022 from TechDream. We carry FaradFlex from Oak-Mitsui Technologies which is an embedded capacitance material, EMIStream from NEC which is an EMI design rule check and plane resonance analysis software, SmartScan from API which is a near-field EMI scanner and PCB materials from RISHO. If you are facing any EMI/SI/PI problems, please […]
RISHO and Electronic Interconnect will host a joint PCB technology webinar on March 3 to introduce latest PCB materials and technologies. Here is the agenda of the webinar. 9:30 – 9:35 Kick-off from Rhonda 9:35 – 10:05 RISHO (by Yoshi Fukawa, President of TechDream) RISHO corporate profile Ultra low-loss materials for antenna White-colored and high […]
American Standard Circuits will host a webinar with Oak-Mitsui Technologies to speak about embedded capacitance technology for FaradFlex. If you are considering implementing embedded capacitance material for your design, please join us!!!
NC State Univirsity hosted webinar “Ultra-High Density Double-Sided Half-Bridge Packaging with Organic Laminates” using RISHO high thermal conductive material (AD-7210N: 10W/mK) to replace DBC with organic laminate. Please check the presentation below!!!
Abstract: A new Epoxy Resin Composite Dielectric (ERCD) laminate has been made available with thicknesses down to 120µm, Rth=10W/mK, VB≥40kV/mm, Tg≥250°C and bondable to prepeg, Al and Cu boards. The thinness provides better thermal performance than DBC alumina with higher reliability. The laminate is ideal for high temperature applications in cost sensitive applications such as […]