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Abstract: A new Epoxy Resin Composite Dielectric (ERCD) laminate has been made available with thicknesses down to 120µm, Rth=10W/mK, VB≥40kV/mm, Tg≥250°C and bondable to prepeg, Al and Cu boards. The thinness provides better thermal performance than DBC alumina with higher reliability. The laminate is ideal for high temperature applications in cost sensitive applications such as […]
American Standard Circuits will host a webinar with Oak-Mitsui Technologies to speak about embedded capacitance technology for FaradFlex. If you are considering implementing embedded capacitance material for your design, please join us!!!
Yoshi will be presenting a joint-paper titled "Reducing the radiation from PCB cavities with a high-DK dielectric layer" at EMC Europe 2020 Virtual to discuss about EMI from PCB cavity with high Dk and ultra-thin embedded capacitance material for higher frequency application such as 5G or mmWave radar.
RISHO high thermal conductive materials will be introduced at Aurora Circuits webinar on 9/30. White-colored material, low-modulus material and ultra high thermal conductive material will be introduced. If you have any thermal issues or solder joint crack issues, please join us.
