Oak-Mitsui Technologies will be exhibiting at DesignCon 2025 from January 28th~30th at the Santa Clara Convention Center to present FaradFlex, a MicroThin and Low-Profile Copper providing the lowest inductance for the best high speed power delivery, minimum noise and optimum signal integrity. Please swing by our booth to check these advanced PCB materials for SI/PI […]
Oak-Mitsui Technologies will be exhibiting at IPC APEX EXPO 2025 at the Anaheim Convention Center in California from March 18th~20th to present their embedded capacitance material FaradFlex, MicroThin and Low Profile Copper. Please stop by our booth if you have time.
API (Amber Precision Instruments) will be exhibiting at EMV 2025 in Stuttgart, Germany from March 25th~27th to present EMC/EMI scanner, SmartScan. Please stop by our booth if you have time.
Our principals, Oak-Mitsui Technologies and API will be exhibiting at EMC & CI in Oxford from May 19th to 21st. Oak-Mitsui Technologies will present FaradFlex, a MicroThin and Low-Profile Copper providing the lowest inductance for the best high speed power delivery, minimum noise and optimum signal integrity. API will present SmartScan 350, a table-top EMI […]
Risho will exhibit at ECTC 2025 in Dallas from May 27th to the 30th to present new PCB materials ranging from low-loss/low-Dk/low-Df materials to low-CTE and low-modulus materials. Risho will also present high thermal conductive materials and white-colored material for LED use as well. Stop by the booth when you have the time!
Oak-Mitsui Technologies will exhibit at IMS 2025 (International Microwave Symposium) at the Moscone Center in San Francisco from June 15th to the 20th to present an embedded capacitance material called FaradFlex. FaradFlex is made to improve SI/PI and PDN and mitigate EMI. MicroThin and Low-Profile Copper will also be showcased. Please join us if you […]
Oak-Mitsui Technologies will exhibit at EMC Europe 2025 at the Sorbonne University in Paris, France from September 1st to the 5th to present embedded capacitance material, FaradFlex. FaradFlex is made to improve SI/PI/PDN and also mitigate EMI. It is frequently used to remove decoupling capacitors from the PCB.
Oak-Mitsui Technologies will exhibit at PCB West 2025 at the Santa Clara Convention Center in California from September 30th to October 3rd. Oak-Mitsui will present their embedded capacitance material, FaradFlex. FaradFlex is frequently used to lower impedance and remove decoupling capacitors from the print circuit board.
API (Amber Precision Instruments) will be exhibiting at NEPCON in Nagoya, Japan from Octuber 29th to the 31st. API will present their EMI/ESD scanner, SmartScan. Features of the EMI scanner include phase measurement and near field to far field transformation. The ESD scanner provides susceptibility map generation and automatic failure detection. Please stop by our […]
Our principals, Oak-Mitsui Technologies, will be exhibiting at EMC & CI in Oxford from April 29th to May 1st. Oak-Mitsui Technologies will present FaradFlex, a MicroThin and Low-Profile Copper providing the lowest inductance for the best high speed power delivery, minimum noise, and optimum signal integrity. Please swing by our booth to check these advanced […]
Our principals, Oak-Mitsui Technologies and API will be exhibiting at Embassy Suites in Michigan on May 7th. Oak-Mitsui Technologies will present FaradFlex, a MicroThin and Low-Profile Copper providing the lowest inductance for the best high speed power delivery, minimum noise, and optimum signal integrity. API will present SmartScan 350, a table-top EMI scanner, and SmartZap, […]
Oak-Mitsui Technologies will exhibit at Focus on PCB 2026 at Fiera di Vicenza in Italy from May 13th to 14th to present embedded capacitance material, FaradFlex. FaradFlex is made to improve SI/PI/PDN and also mitigate EMI. It is frequently used to remove decoupling capacitors from the PCB.