BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//TechDream - ECPv6.6.4.2//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:TechDream
X-ORIGINAL-URL:https://www.tech-dream.com
X-WR-CALDESC:Events for TechDream
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20200308T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20201101T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20210314T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20211107T090000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20211006T080000
DTEND;TZID=America/Los_Angeles:20211006T170000
DTSTAMP:20260403T134228
CREATED:20210622T153108Z
LAST-MODIFIED:20210622T153108Z
UID:2780-1633507200-1633539600@www.tech-dream.com
SUMMARY:PCB West 2021
DESCRIPTION:
URL:https://www.tech-dream.com/events/pcb-west-2021/
LOCATION:Santa Clara Convention Center\, 5001 Great America Pkwy\, Santa Clara\, CA\, 95054\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.tech-dream.com/wp-content/uploads/2021/06/PCB-West-2021.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20210817T110000
DTEND;TZID=America/Los_Angeles:20210818T180000
DTSTAMP:20260403T134228
CREATED:20210622T152115Z
LAST-MODIFIED:20210811T183004Z
UID:2776-1629198000-1629309600@www.tech-dream.com
SUMMARY:DesignCon 2021
DESCRIPTION:Oak-Mitsui Technologies will be exhibiting at DesignCon 2021 in Silicon Valley from 8/17 to 8/18 to present MicroThin and FaradFlex. Please join us!!! 🙂
URL:https://www.tech-dream.com/events/designcon-2021/
LOCATION:San Jose McEnery Convention Center\, 150 W San Carlos St.\, San Jose\, CA\, 95113\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.tech-dream.com/wp-content/uploads/2021/06/DesignCon2021.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20210608
DTEND;VALUE=DATE:20210610
DTSTAMP:20260403T134228
CREATED:20210604T174544Z
LAST-MODIFIED:20210604T190217Z
UID:2756-1623110400-1623283199@www.tech-dream.com
SUMMARY:IMS 2021 in Atlanta
DESCRIPTION:Oak-Mitsui Technologies will be exhibiting at IMS 2021 in Atlanta from 6/8 to 6/9 to present MicroThin and FaradFlex. Please join us!!! 🙂 \n \n 
URL:https://www.tech-dream.com/events/ims-2021-in-atlanta/
LOCATION:CO
ATTACH;FMTTYPE=image/jpeg:https://www.tech-dream.com/wp-content/uploads/2021/06/Oak-Mitsui_IMS2021.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20210311T100000
DTEND;TZID=America/Los_Angeles:20210311T110000
DTSTAMP:20260403T134228
CREATED:20210308T163602Z
LAST-MODIFIED:20210308T163602Z
UID:2699-1615456800-1615460400@www.tech-dream.com
SUMMARY:Automotive OTA Test Webinar
DESCRIPTION:TOYOTech will host a joint webinar with GTS (General Test Systems) for automotive OTA test on March 11.
URL:https://www.tech-dream.com/events/automotive-ota-test-webinar/
LOCATION:CO
ATTACH;FMTTYPE=image/jpeg:https://www.tech-dream.com/wp-content/uploads/2021/03/Toyo_Webinar.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20210303T093000
DTEND;TZID=America/Los_Angeles:20210303T104500
DTSTAMP:20260403T134229
CREATED:20210215T222140Z
LAST-MODIFIED:20210217T173120Z
UID:2633-1614763800-1614768300@www.tech-dream.com
SUMMARY:PCB Technology Webinar 2021
DESCRIPTION:RISHO and Electronic Interconnect will host a joint PCB technology webinar on March 3 to introduce latest PCB materials and technologies.\nHere is the agenda of the webinar. \n\n9:30 – 9:35   Kick-off from Rhonda\n9:35 – 10:05   RISHO (by Yoshi Fukawa\, President of TechDream)\n\nRISHO corporate profile\nUltra low-loss materials for antenna\nWhite-colored and high thermal conductive materials for LED\nLow-modulus materials for solder joint crack prevention\n\n\n10:05- 10:35   Electronic Interconnect (by Pratish Patel\, CTO of EI)\n\nFundamentals of thermal management and its applications\nMaterial introductions to support the fundamental of TM\nCapabilities in terms of fabricator and materials\nDesign guidelines\nCase studies\n\n\n10:35 – 10:45   Q&A\n\n\n 
URL:https://www.tech-dream.com/events/pcb-technology-webinar-2021/
LOCATION:San Jose McEnery Convention Center\, 150 W San Carlos St.\, San Jose\, CA\, 95113\, United States
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20210112T070000
DTEND;TZID=America/Los_Angeles:20210112T080000
DTSTAMP:20260403T134229
CREATED:20210105T180901Z
LAST-MODIFIED:20210105T181004Z
UID:2603-1610434800-1610438400@www.tech-dream.com
SUMMARY:Technical Webinar from Prof. David Pommerenke to speak about near-field EMI scan technology
DESCRIPTION:Prof. David Pommerenke from Graz University will speak about near-field EMI scan technology on 1/12 at 7 am PST. If you are interested in near-field EMI scan technology\, please join us. \nhttps://site.ieee.org/germany-emc/files/2020/12/ieee_german_emc_chapter_technical_teleconference_Pommerenke_v2.pdf \n 
URL:https://www.tech-dream.com/events/technical-webinar-from-prof-david-pommerenke/
LOCATION:CO
ATTACH;FMTTYPE=image/jpeg:https://www.tech-dream.com/wp-content/uploads/2021/01/Webinar.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20200930T100000
DTEND;TZID=America/Los_Angeles:20200930T110000
DTSTAMP:20260403T134229
CREATED:20200926T153839Z
LAST-MODIFIED:20200926T153839Z
UID:2556-1601460000-1601463600@www.tech-dream.com
SUMMARY:Thermal Management Webinar with Aurora Circuits
DESCRIPTION:RISHO high thermal conductive materials will be introduced at Aurora Circuits webinar on 9/30. White-colored material\, low-modulus material and ultra high thermal conductive material will be introduced. If you have any thermal issues or solder joint crack issues\, please join us.
URL:https://www.tech-dream.com/events/thermal-management-webinar-with-aurora-circuits/
LOCATION:CO
ATTACH;FMTTYPE=image/png:https://www.tech-dream.com/wp-content/uploads/2020/09/Thermal-Management-Webinar-1.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20200923T080000
DTEND;TZID=America/Los_Angeles:20200925T170000
DTSTAMP:20260403T134229
CREATED:20200917T212653Z
LAST-MODIFIED:20200917T213307Z
UID:2550-1600848000-1601053200@www.tech-dream.com
SUMMARY:EMC Europe 2020 Virtual
DESCRIPTION:Yoshi will be presenting a joint-paper titled “Reducing the radiation from PCB cavities with a high-DK dielectric layer” at EMC Europe 2020 Virtual to discuss about EMI from PCB cavity with high Dk and ultra-thin embedded capacitance material for higher frequency application such as 5G or mmWave radar.
URL:https://www.tech-dream.com/events/emc-europe-2020-virtual/
LOCATION:CO
ATTACH;FMTTYPE=image/png:https://www.tech-dream.com/wp-content/uploads/2020/09/EMC-Europe-2020.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20200909T110000
DTEND;TZID=America/Los_Angeles:20200909T120000
DTSTAMP:20260403T134229
CREATED:20200904T181319Z
LAST-MODIFIED:20200904T181528Z
UID:2542-1599649200-1599652800@www.tech-dream.com
SUMMARY:Time-Domain EMI Measurement Webinar from TOYO
DESCRIPTION:
URL:https://www.tech-dream.com/events/time-domain-emi-measurement-webinar-from-toyo/
LOCATION:CO
ATTACH;FMTTYPE=image/jpeg:https://www.tech-dream.com/wp-content/uploads/2020/09/EPX.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20200909T090000
DTEND;TZID=America/Los_Angeles:20200912T150000
DTSTAMP:20260403T134229
CREATED:20200514T234348Z
LAST-MODIFIED:20200904T181942Z
UID:2364-1599642000-1599922800@www.tech-dream.com
SUMMARY:PCB West 2020 Virtual
DESCRIPTION:
URL:https://www.tech-dream.com/events/pcb-west-2020/
LOCATION:Santa Clara Convention Center\, 5001 Great America Pkwy\, Santa Clara\, CA\, 95054\, United States
ATTACH;FMTTYPE=image/png:https://www.tech-dream.com/wp-content/uploads/2020/05/PCBWest2020_Logo_Web.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20200907T090000
DTEND;TZID=America/Los_Angeles:20200907T150000
DTSTAMP:20260403T134229
CREATED:20200904T180900Z
LAST-MODIFIED:20200904T181605Z
UID:2539-1599469200-1599490800@www.tech-dream.com
SUMMARY:Embedded Capacitance Technology Session at PCB West 2020 Virtual
DESCRIPTION:
URL:https://www.tech-dream.com/events/embedded-capacitance-technology-session-at-pcb-west-2020-virtual/
LOCATION:CO
ATTACH;FMTTYPE=image/png:https://www.tech-dream.com/wp-content/uploads/2020/09/PCB-West-2020.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20200805T090000
DTEND;TZID=America/Los_Angeles:20200805T100000
DTSTAMP:20260403T134229
CREATED:20200729T230730Z
LAST-MODIFIED:20200729T230730Z
UID:2497-1596618000-1596621600@www.tech-dream.com
SUMMARY:Embedded Capacitance Webinar
DESCRIPTION:American Standard Circuits will host a webinar with Oak-Mitsui Technologies to speak about embedded capacitance technology for FaradFlex. If you are considering implementing embedded capacitance material for your design\, please join us!!!
URL:https://www.tech-dream.com/events/embedded-capacitance-webinar/
LOCATION:CO
ATTACH;FMTTYPE=image/jpeg:https://www.tech-dream.com/wp-content/uploads/2020/07/FaradFlex-Webinar.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20200727T100000
DTEND;TZID=America/Los_Angeles:20200731T120000
DTSTAMP:20260403T134229
CREATED:20200514T064227Z
LAST-MODIFIED:20200515T213548Z
UID:2322-1595844000-1596196800@www.tech-dream.com
SUMMARY:IEEE EMC Symposium 2020 in Reno
DESCRIPTION:
URL:https://www.tech-dream.com/events/ieee-emc-symposium-2020-in-reno/
LOCATION:Reno Sparks Convention Center\, 3800 South Virginia Street\, Reno\, NV\, 89502\, United States
ATTACH;FMTTYPE=image/png:https://www.tech-dream.com/wp-content/uploads/2020/05/EMC-SIPI-2020.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20200723T080000
DTEND;TZID=America/Los_Angeles:20200723T090000
DTSTAMP:20260403T134229
CREATED:20200717T205558Z
LAST-MODIFIED:20200717T205558Z
UID:2482-1595491200-1595494800@www.tech-dream.com
SUMMARY:PSMA PTR Webinar from NC State University
DESCRIPTION:Abstract: A new Epoxy Resin Composite Dielectric (ERCD) laminate has been made available with thicknesses down to 120µm\, Rth=10W/mK\, VB≥40kV/mm\, Tg≥250°C and bondable to prepeg\, Al and Cu boards. The thinness provides better thermal performance than DBC alumina with higher reliability. The laminate is ideal for high temperature applications in cost sensitive applications such as automotive and telecom power. This new substrate approach opens new module configurations for heterogeneous integration of power and signal\, along with sensing\, and supports the recent advances in small-die-size power WBG devices. This webinar takes a comprehensive approach to introducing components\, materials\, equipment and processes for working with new laminates\, and provides a detailed design approach to double-sided power electronics converter modules.
URL:https://www.tech-dream.com/events/psma-ptr-webinar-from-nc-state-university/
LOCATION:CO
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20200621T080000
DTEND;TZID=America/Los_Angeles:20200626T170000
DTSTAMP:20260403T134229
CREATED:20200514T165910Z
LAST-MODIFIED:20200515T213742Z
UID:2332-1592726400-1593190800@www.tech-dream.com
SUMMARY:International Microwave Show 2020
DESCRIPTION:
URL:https://www.tech-dream.com/events/international-microwave-show/
LOCATION:Los Angeles Convention Center\, 1201 S Figueroa St\,\, Los Angeles\, CA\, 90015\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.tech-dream.com/wp-content/uploads/2020/05/2020_IMS_Fill-in-Ad_Pics500x300-2.jpg
END:VEVENT
END:VCALENDAR