TechDream

Oak-Mitsui Technologies at DesignCon 2023
2023-01-31 08:00 - 2023-02-02 17:00 (America/Los_Angeles) | Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, 95054, United States
Oak-Mitsui Technologies will exhibit at DesignCon 2023 at Santa Clara Convention Center from 1/31-2/2 to present an embedded capacitance material called FaradFlex, Micro-Thin and low-profile copper. Please join us!!! 🙂

Oak-Mitsui Technologies at IPC APEX 2023
2023-01-24 08:00 - 2023-01-26 17:00 | San Diego Convention Center
Oak-Mitsui Technologies will exhibit at IPC APEX 2023 at San Diego Convention Center from 1/24-26 to present an embedded capacitance material called FaradFlex, Micro-Thin and low-profile copper. Please join us!!! 🙂

Joint ESD Seminar in Japan
2022-12-09 13:30 - 17:30
Mitsui Kinzoku, CSi Global Alliance and Dassault will host the joint ESD seminar in Tokyo on December 9th. Mitsui Kinzoku will present FaradFlex to improve ESD performance and CSi will present SmartScan to debug ESD issues as well as SmartZap for automated ESD testing. If you have time, please join us!!! 🙂

electronica 2022
2022-11-15 08:00 - 2022-11-18 17:00
Risho will exhibit at electronica 2022 on 11/15-18 to present PCB materials including high thermal conductive materials, low-modulus and low-CTE materials, white-colored materials for LED and low-loss materials. Please join us at booth #B1.235.

PCB Carolina 2022
2022-11-09 08:00 - 17:00 | McKimmon Center, 1101 Gorman Street, Raleigh, NC, 27606, United States
Oak-Mitsui Technologies will be exhibiting at PCB Carolina 2022 at McKimmon Center in NC State University on 11/9. We will present an embedded capacitance material called FaradFlex, ultra thin copper foil called MicroThin and very low-profile copper. Please stop by our booth if you have time!!! 🙂

PCB West 2022
2022-10-05 10:00 - 18:00 | Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, 95054, United States
Oak-Mitsui Technologies will exhibit at PCB West 2022 at Santa Clara Convention Center on 10/5 to present an embedded capacitance material called FaradFlex to improve SI/PI and PDN and mitigate EMI. MicroThin and Low-Profile Copper will also be showcased. Please join us if you have time!!! 🙂

IEEE EMC Symposium 2022
2022-08-02 08:00 - 2022-08-04 17:00
TechDream will be attending at IEEE EMC Symposium 2022 in Spokane.

EMV 2022
2022-07-12 08:00 - 2022-07-14 17:00
API (Amber Precision Instruments) will be exhibiting at EMV 2022 in Cologne from July 12 -14 to present EMC/EMI scanner, SmartScan and ESD tester, SmartZap.

IMS 2022 in Denver
2022-06-21 08:00 - 2022-06-23 17:00 | Colorado Convention Center, 700 14th St., Denver, CO, 80202, United States
Oak-Mitsui Technologies will be exhibiting at IMS 2022 at Colorado Convention Center in Denver from June 21 to 23 to present FaradFlex, MicroThin and Low-Profile Copper. Please swing by our booth #12035 to check these advanced PCB materials for SI/PI and EMI!!!

Altium Live 2022
2022-01-26 08:00 - 2022-01-28 17:00
NEC will exhibit at Altium Live 2022 to give a technical presentation as well as showcasing Altium extension of EMIStream for EMI design rule check and plane resonance analysis. If you have time, please join us!!!

IPC APEX 2022
2022-01-25 08:00 - 2022-01-27 17:00 | San Diego Convention Center
Oak-Mitsui Technologies will exhibit at IPC APEX 2022 at San Diego Convention Center from January 25 to 27 to showcase FaradFlex, MicroThin and low-profile copper. Please join us!!!

PCB Carolina 2021
2021-11-10 08:00 - 17:00 | McKimmon Center, 1101 Gorman Street, Raleigh, NC, 27606, United States
Oak-Mitsui Technologies will exhibit at PCB Carolina 2021 at NC State University on November 10th showcasing FaradFlex, MicroThin and low-profile coppers.

PCB West 2021
2021-10-06 08:00 - 17:00 | Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, 95054, United States

DesignCon 2021
2021-08-17 11:00 - 2021-08-18 18:00 | San Jose McEnery Convention Center, 150 W San Carlos St., San Jose, CA, 95113, United States
Oak-Mitsui Technologies will be exhibiting at DesignCon 2021 in Silicon Valley from 8/17 to 8/18 to present MicroThin and FaradFlex. Please join us!!! 🙂

IMS 2021 in Atlanta
2021-06-08 - 2021-06-09
Oak-Mitsui Technologies will be exhibiting at IMS 2021 in Atlanta from 6/8 to 6/9 to present MicroThin and FaradFlex. Please join us!!! 🙂

Automotive OTA Test Webinar
2021-03-11 10:00 - 11:00
TOYOTech will host a joint webinar with GTS (General Test Systems) for automotive OTA test on March 11.

PCB Technology Webinar 2021
2021-03-03 09:30 - 10:45 | San Jose McEnery Convention Center, 150 W San Carlos St., San Jose, CA, 95113, United States
RISHO and Electronic Interconnect will host a joint PCB technology webinar on March 3 to introduce latest PCB materials and technologies.
Here is the agenda of the webinar.

9:30 – 9:35 Kick-off from Rhonda
9:35 – 10:05 RISHO (by Yoshi Fukawa, President of TechDream)

RISHO corporate profile
Ultra low-loss materials for antenna
White-colored and high thermal conductive materials for LED
Low-modulus materials for solder joint crack prevention

10:05- 10:35 Electronic Interconnect (by Pratish Patel, CTO of EI)

Fundamentals of thermal management and its applications
Material introductions to support the fundamental of TM
Capabilities in terms of fabricator and materials
Design guidelines
Case studies

10:35 – 10:45 Q&A

Technical Webinar from Prof. David Pommerenke to speak about near-field EMI scan technology
2021-01-12 07:00 - 08:00
Prof. David Pommerenke from Graz University will speak about near-field EMI scan technology on 1/12 at 7 am PST. If you are interested in near-field EMI scan technology, please join us.
https://site.ieee.org/germany-emc/files/2020/12/ieee_german_emc_chapter_technical_teleconference_Pommerenke_v2.pdf

Thermal Management Webinar with Aurora Circuits
2020-09-30 10:00 - 11:00
RISHO high thermal conductive materials will be introduced at Aurora Circuits webinar on 9/30. White-colored material, low-modulus material and ultra high thermal conductive material will be introduced. If you have any thermal issues or solder joint crack issues, please join us.

EMC Europe 2020 Virtual
2020-09-23 08:00 - 2020-09-25 17:00
Yoshi will be presenting a joint-paper titled “Reducing the radiation from PCB cavities with a high-DK dielectric layer” at EMC Europe 2020 Virtual to discuss about EMI from PCB cavity with high Dk and ultra-thin embedded capacitance material for higher frequency application such as 5G or mmWave radar.

Time-Domain EMI Measurement Webinar from TOYO
2020-09-09 11:00 - 12:00

PCB West 2020 Virtual
2020-09-09 09:00 - 2020-09-12 15:00 | Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, 95054, United States

Embedded Capacitance Technology Session at PCB West 2020 Virtual
2020-09-07 09:00 - 15:00

Embedded Capacitance Webinar
2020-08-05 09:00 - 10:00
American Standard Circuits will host a webinar with Oak-Mitsui Technologies to speak about embedded capacitance technology for FaradFlex. If you are considering implementing embedded capacitance material for your design, please join us!!!

IEEE EMC Symposium 2020 in Reno
2020-07-27 10:00 - 2020-07-31 12:00 | Reno Sparks Convention Center, 3800 South Virginia Street, Reno, NV, 89502, United States

PSMA PTR Webinar from NC State University
2020-07-23 08:00 - 09:00
Abstract: A new Epoxy Resin Composite Dielectric (ERCD) laminate has been made available with thicknesses down to 120µm, Rth=10W/mK, VB≥40kV/mm, Tg≥250°C and bondable to prepeg, Al and Cu boards. The thinness provides better thermal performance than DBC alumina with higher reliability. The laminate is ideal for high temperature applications in cost sensitive applications such as automotive and telecom power. This new substrate approach opens new module configurations for heterogeneous integration of power and signal, along with sensing, and supports the recent advances in small-die-size power WBG devices. This webinar takes a comprehensive approach to introducing components, materials, equipment and processes for working with new laminates, and provides a detailed design approach to double-sided power electronics converter modules.

International Microwave Show 2020
2020-06-21 08:00 - 2020-06-26 17:00 | Los Angeles Convention Center, 1201 S Figueroa St,, Los Angeles, CA, 90015, United States
