TechDream

Altium Live 2022
2022-01-26 08:00 - 2022-01-28 17:00 (America/Los_Angeles)
NEC will exhibit at Altium Live 2022 to give a technical presentation as well as showcasing Altium extension of EMIStream for EMI design rule check and plane resonance analysis. If you have time, please join us!!!

IPC APEX 2022
2022-01-25 08:00 - 2022-01-27 17:00 | San Diego Convention Center
Oak-Mitsui Technologies will exhibit at IPC APEX 2022 at San Diego Convention Center from January 25 to 27 to showcase FaradFlex, MicroThin and low-profile copper. Please join us!!!

PCB Carolina 2021
2021-11-10 08:00 - 17:00 | McKimmon Center, 1101 Gorman Street, Raleigh, NC, 27606, United States
Oak-Mitsui Technologies will exhibit at PCB Carolina 2021 at NC State University on November 10th showcasing FaradFlex, MicroThin and low-profile coppers.

PCB West 2021
2021-10-06 08:00 - 17:00 | Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, 95054, United States

DesignCon 2021
2021-08-17 11:00 - 2021-08-18 18:00 | San Jose McEnery Convention Center, 150 W San Carlos St., San Jose, CA, 95113, United States
Oak-Mitsui Technologies will be exhibiting at DesignCon 2021 in Silicon Valley from 8/17 to 8/18 to present MicroThin and FaradFlex. Please join us!!! 🙂

IMS 2021 in Atlanta
2021-06-08 - 2021-06-09
Oak-Mitsui Technologies will be exhibiting at IMS 2021 in Atlanta from 6/8 to 6/9 to present MicroThin and FaradFlex. Please join us!!! 🙂

Automotive OTA Test Webinar
2021-03-11 10:00 - 11:00
TOYOTech will host a joint webinar with GTS (General Test Systems) for automotive OTA test on March 11.

PCB Technology Webinar 2021
2021-03-03 09:30 - 10:45 | San Jose McEnery Convention Center, 150 W San Carlos St., San Jose, CA, 95113, United States
RISHO and Electronic Interconnect will host a joint PCB technology webinar on March 3 to introduce latest PCB materials and technologies.
Here is the agenda of the webinar.

9:30 – 9:35 Kick-off from Rhonda
9:35 – 10:05 RISHO (by Yoshi Fukawa, President of TechDream)

RISHO corporate profile
Ultra low-loss materials for antenna
White-colored and high thermal conductive materials for LED
Low-modulus materials for solder joint crack prevention

10:05- 10:35 Electronic Interconnect (by Pratish Patel, CTO of EI)

Fundamentals of thermal management and its applications
Material introductions to support the fundamental of TM
Capabilities in terms of fabricator and materials
Design guidelines
Case studies

10:35 – 10:45 Q&A

Technical Webinar from Prof. David Pommerenke to speak about near-field EMI scan technology
2021-01-12 07:00 - 08:00
Prof. David Pommerenke from Graz University will speak about near-field EMI scan technology on 1/12 at 7 am PST. If you are interested in near-field EMI scan technology, please join us.
https://site.ieee.org/germany-emc/files/2020/12/ieee_german_emc_chapter_technical_teleconference_Pommerenke_v2.pdf

Thermal Management Webinar with Aurora Circuits
2020-09-30 10:00 - 11:00
RISHO high thermal conductive materials will be introduced at Aurora Circuits webinar on 9/30. White-colored material, low-modulus material and ultra high thermal conductive material will be introduced. If you have any thermal issues or solder joint crack issues, please join us.

EMC Europe 2020 Virtual
2020-09-23 08:00 - 2020-09-25 17:00
Yoshi will be presenting a joint-paper titled “Reducing the radiation from PCB cavities with a high-DK dielectric layer” at EMC Europe 2020 Virtual to discuss about EMI from PCB cavity with high Dk and ultra-thin embedded capacitance material for higher frequency application such as 5G or mmWave radar.

Time-Domain EMI Measurement Webinar from TOYO
2020-09-09 11:00 - 12:00

PCB West 2020 Virtual
2020-09-09 09:00 - 2020-09-12 15:00 | Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, 95054, United States

Embedded Capacitance Technology Session at PCB West 2020 Virtual
2020-09-07 09:00 - 15:00

Embedded Capacitance Webinar
2020-08-05 09:00 - 10:00
American Standard Circuits will host a webinar with Oak-Mitsui Technologies to speak about embedded capacitance technology for FaradFlex. If you are considering implementing embedded capacitance material for your design, please join us!!!

IEEE EMC Symposium 2020 in Reno
2020-07-27 10:00 - 2020-07-31 12:00 | Reno Sparks Convention Center, 3800 South Virginia Street, Reno, NV, 89502, United States

PSMA PTR Webinar from NC State University
2020-07-23 08:00 - 09:00
Abstract: A new Epoxy Resin Composite Dielectric (ERCD) laminate has been made available with thicknesses down to 120µm, Rth=10W/mK, VB≥40kV/mm, Tg≥250°C and bondable to prepeg, Al and Cu boards. The thinness provides better thermal performance than DBC alumina with higher reliability. The laminate is ideal for high temperature applications in cost sensitive applications such as automotive and telecom power. This new substrate approach opens new module configurations for heterogeneous integration of power and signal, along with sensing, and supports the recent advances in small-die-size power WBG devices. This webinar takes a comprehensive approach to introducing components, materials, equipment and processes for working with new laminates, and provides a detailed design approach to double-sided power electronics converter modules.

International Microwave Show 2020
2020-06-21 08:00 - 2020-06-26 17:00 | Los Angeles Convention Center, 1201 S Figueroa St,, Los Angeles, CA, 90015, United States
