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PRODID:-//TechDream - ECPv6.6.4.2//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:TechDream
X-ORIGINAL-URL:https://www.tech-dream.com
X-WR-CALDESC:Events for TechDream
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20250309T100000
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BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20251102T090000
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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250128T090000
DTEND;TZID=America/Los_Angeles:20250130T180000
DTSTAMP:20260405T101832
CREATED:20250103T190218Z
LAST-MODIFIED:20250103T191505Z
UID:3239-1738054800-1738260000@www.tech-dream.com
SUMMARY:DesignCon 2025
DESCRIPTION:Oak-Mitsui Technologies will be exhibiting at DesignCon 2025 from January 28th~30th at the Santa Clara Convention Center to present FaradFlex\, a MicroThin and Low-Profile Copper providing the lowest inductance for the best high speed power delivery\, minimum noise and optimum signal integrity. \nPlease swing by our booth to check these advanced PCB materials for SI/PI and EMI.
URL:https://www.tech-dream.com/events/designcon-2025/
LOCATION:Santa Clara Convention Center\, 5001 Great America Pkwy\, Santa Clara\, CA\, 95054\, United States
ATTACH;FMTTYPE=image/webp:https://www.tech-dream.com/wp-content/uploads/2025/01/dc25-web-top-designcon-30th-anniversary-logo-sponsor-amphenol.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250318
DTEND;VALUE=DATE:20250321
DTSTAMP:20260405T101832
CREATED:20250205T090331Z
LAST-MODIFIED:20250205T090331Z
UID:3306-1742256000-1742515199@www.tech-dream.com
SUMMARY:IPC APEX EXPO 2025
DESCRIPTION:Oak-Mitsui Technologies will be exhibiting at IPC APEX EXPO 2025 at the Anaheim Convention Center in California from March 18th~20th to present their embedded capacitance material FaradFlex\, MicroThin and Low Profile Copper. \nPlease stop by our booth if you have time.
URL:https://www.tech-dream.com/events/ipc-apex-expo-2025/
LOCATION:Anaheim Convention Center\, 800 W Katella Ave\, Anaheim\, CA\, 92802\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.tech-dream.com/wp-content/uploads/2025/02/apex25-green-logo.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250325
DTEND;VALUE=DATE:20250328
DTSTAMP:20260405T101832
CREATED:20250103T191141Z
LAST-MODIFIED:20250205T085851Z
UID:3242-1742860800-1743119999@www.tech-dream.com
SUMMARY:EMV 2025
DESCRIPTION:API (Amber Precision Instruments) will be exhibiting at EMV 2025 in Stuttgart\, Germany from March 25th~27th to present EMC/EMI scanner\, SmartScan. \nPlease stop by our booth if you have time.
URL:https://www.tech-dream.com/events/emv-2025/
LOCATION:ICS International Congress Center Stuttgart\, Messepiazza 1\, 70629\, Stuttgart\, Leinfelden-Echterdingen\, Germany
ATTACH;FMTTYPE=image/png:https://www.tech-dream.com/wp-content/uploads/2025/01/Screenshot-9.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250519
DTEND;VALUE=DATE:20250522
DTSTAMP:20260405T101832
CREATED:20250414T105905Z
LAST-MODIFIED:20250414T122525Z
UID:3322-1747612800-1747871999@www.tech-dream.com
SUMMARY:EMC & CI 2025
DESCRIPTION:Our principals\, Oak-Mitsui Technologies and API will be exhibiting at EMC & CI in Oxford from May 19th to 21st. \nOak-Mitsui Technologies will present FaradFlex\, a MicroThin and Low-Profile Copper providing the lowest inductance for the best high speed power delivery\, minimum noise and optimum signal integrity. \nAPI will present SmartScan 350\, a table-top EMI scanner and SmartZap\, an automated Robotic ESD Gun tester. \nPlease swing by our booth to check these advanced PCB materials and scanners for SI/PI and EMI use.
URL:https://www.tech-dream.com/events/emc-ci-2025/
LOCATION:St Anne’s College\, 56 Woodstock Road\, Oxford\, OX2 6HS\, United Kingdom
ATTACH;FMTTYPE=image/png:https://www.tech-dream.com/wp-content/uploads/2025/04/Screenshot-8.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250527
DTEND;VALUE=DATE:20250531
DTSTAMP:20260405T101832
CREATED:20250424T150014Z
LAST-MODIFIED:20250424T150014Z
UID:3369-1748304000-1748649599@www.tech-dream.com
SUMMARY:ECTC 2025
DESCRIPTION:Risho will exhibit at ECTC 2025 in Dallas from May 27th to the 30th to present new PCB materials ranging from low-loss/low-Dk/low-Df materials to low-CTE and low-modulus materials. Risho will also present high thermal conductive materials and white-colored material for LED use as well. Stop by the booth when you have the time!
URL:https://www.tech-dream.com/events/ectc-2025/
LOCATION:Gaylord Texan Resort & Convention Center\, 1501 Gaylord Trail\, Grapevine\, TX\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.tech-dream.com/wp-content/uploads/2025/04/download.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20250615T080000
DTEND;TZID=America/Los_Angeles:20250620T170000
DTSTAMP:20260405T101832
CREATED:20250424T150627Z
LAST-MODIFIED:20250425T043105Z
UID:3373-1749974400-1750438800@www.tech-dream.com
SUMMARY:IMS 2025
DESCRIPTION:Oak-Mitsui Technologies will exhibit at IMS 2025 (International Microwave Symposium) at the Moscone Center in San Francisco from June 15th to the 20th to present an embedded capacitance material called FaradFlex. FaradFlex is made to improve SI/PI and PDN and mitigate EMI. MicroThin and Low-Profile Copper will also be showcased. Please join us if you have time! 🙂
URL:https://www.tech-dream.com/events/ims-2025/
LOCATION:Moscone Center\, 747 Howard St\, San Francisco\, CA\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.tech-dream.com/wp-content/uploads/2025/04/ims-logo.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250901
DTEND;VALUE=DATE:20250906
DTSTAMP:20260405T101832
CREATED:20250825T181240Z
LAST-MODIFIED:20250825T181240Z
UID:3504-1756684800-1757116799@www.tech-dream.com
SUMMARY:EMC Europe 2025
DESCRIPTION:Oak-Mitsui Technologies will exhibit at EMC Europe 2025 at the Sorbonne University in Paris\, France from September 1st to the 5th to present embedded capacitance material\, FaradFlex. FaradFlex is made to improve SI/PI/PDN and also mitigate EMI. It is frequently used to remove decoupling capacitors from the PCB.
URL:https://www.tech-dream.com/events/emc-europe-2025/
LOCATION:Sorbonne University\, 4 Pl. Jussieu\, Paris\, 75005\, France
ATTACH;FMTTYPE=image/jpeg:https://www.tech-dream.com/wp-content/uploads/2025/08/download.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250930
DTEND;VALUE=DATE:20251005
DTSTAMP:20260405T101832
CREATED:20250825T195837Z
LAST-MODIFIED:20250825T195837Z
UID:3508-1759190400-1759622399@www.tech-dream.com
SUMMARY:PCB West 2025
DESCRIPTION:Oak-Mitsui Technologies will exhibit at PCB West 2025 at the Santa Clara Convention Center in California from September 30th to October 3rd. \nOak-Mitsui will present their embedded capacitance material\, FaradFlex. \nFaradFlex is frequently used to lower impedance and remove decoupling capacitors from the print circuit board.
URL:https://www.tech-dream.com/events/pcb-west-2025/
LOCATION:Santa Clara Convention Center\, 5001 Great America Pkwy\, Santa Clara\, CA\, 95054\, United States
ATTACH;FMTTYPE=image/png:https://www.tech-dream.com/wp-content/uploads/2025/08/pcbwest.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251029
DTEND;VALUE=DATE:20251101
DTSTAMP:20260405T101832
CREATED:20250825T200702Z
LAST-MODIFIED:20250825T200702Z
UID:3511-1761696000-1761955199@www.tech-dream.com
SUMMARY:NEPCON NAGOYA
DESCRIPTION:API (Amber Precision Instruments) will be exhibiting at NEPCON in Nagoya\, Japan from Octuber 29th to the 31st. \nAPI will present their EMI/ESD scanner\, SmartScan. \nFeatures of the EMI scanner include phase measurement and near field to far field transformation. \nThe ESD scanner provides susceptibility map generation and automatic failure detection. \nPlease stop by our booth if you will be at the convention!
URL:https://www.tech-dream.com/events/nepcon-nagoya/
LOCATION:Port Messe Nagoya\, 2-7 Kinjofuto\, Japan
ATTACH;FMTTYPE=image/png:https://www.tech-dream.com/wp-content/uploads/2025/08/nepcon.png
END:VEVENT
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