NC State Univirsity hosted webinar “Ultra-High Density Double-Sided Half-Bridge Packaging with Organic Laminates” using RISHO high thermal conductive material (AD-7210N: 10W/mK) to replace DBC with organic laminate. Please check the presentation below!!!
Abstract: A new Epoxy Resin Composite Dielectric (ERCD) laminate has been made available with thicknesses down to 120µm, Rth=10W/mK, VB≥40kV/mm, Tg≥250°C and bondable to prepeg, Al and Cu boards. The thinness provides better thermal performance than DBC alumina with higher reliability. The laminate is ideal for high temperature applications in cost sensitive applications such as […]
