EMC Europe 2022

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Taiki Kitazawa from NAIST (Nara Institute of Science and Technology) presented a paper titled “Analysis of the PDN Induced Crosstalk Impacts on the High-Speed Signaling in Ultra-Thin and High Permittivity Substrates” at EMC Europe 2022 in Gothenburg last week.Great job and thanks Kitazawa-san for evaluating embedded capacitance material called FaradFlex from Oak-Mitsui Technologies and hope to […]

DesignCon 2021 Wrap-Up

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Oak-Mitsui Technologies exhibited DesignCon 2021 at San Jose Convention Center to present FaradFlex and MicroThin. FaradFlex is an embedded capacitance material to improve SI/PI and mitigate EMI.