Oak-Mitsui Technologies will exhibit at PCB West 2022 at Santa Clara Convention Center on 10/5 to present an embedded capacitance material called FaradFlex to improve SI/PI and PDN and mitigate EMI. MicroThin and Low-Profile Copper will also be showcased. Please join us if you have time!!! :)
Oak-Mitsui Technologies will be exhibiting at PCB Carolina 2022 at McKimmon Center in NC State University on 11/9. We will present an embedded capacitance material called FaradFlex, ultra thin copper foil called MicroThin and very low-profile copper. Please stop by our booth if you have time!!! :)
Oak-Mitsui Technologies will exhibit at IPC APEX 2023 at San Diego Convention Center from 1/24-26 to present an embedded capacitance material called FaradFlex, Micro-Thin and low-profile copper. Please join us!!! :)
Oak-Mitsui Technologies will exhibit at DesignCon 2023 at Santa Clara Convention Center from 1/31-2/2 to present an embedded capacitance material called FaradFlex, Micro-Thin and low-profile copper. Please join us!!! :)