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RISHO and Electronic Interconnect will host a joint PCB technology webinar on March 3 to introduce latest PCB materials and technologies. Here is the agenda of the webinar. 9:30 - 9:35 Kick-off from Rhonda 9:35 - 10:05 RISHO (by Yoshi Fukawa, President of TechDream) RISHO corporate profile Ultra low-loss materials for antenna White-colored and high […]
Oak-Mitsui Technologies will exhibit at PCB West 2022 at Santa Clara Convention Center on 10/5 to present an embedded capacitance material called FaradFlex to improve SI/PI and PDN and mitigate EMI. MicroThin and Low-Profile Copper will also be showcased. Please join us if you have time!!! :)
Oak-Mitsui Technologies will be exhibiting at PCB Carolina 2022 at McKimmon Center in NC State University on 11/9. We will present an embedded capacitance material called FaradFlex, ultra thin copper foil called MicroThin and very low-profile copper. Please stop by our booth if you have time!!! :)
Risho will exhibit at electronica 2022 on 11/15-18 to present PCB materials including high thermal conductive materials, low-modulus and low-CTE materials, white-colored materials for LED and low-loss materials. Please join us at booth #B1.235.
Oak-Mitsui Technologies will exhibit at DesignCon 2023 at Santa Clara Convention Center from 1/31-2/2 to present an embedded capacitance material called FaradFlex, Micro-Thin and low-profile copper. Please join us!!! :)