Abstract: A new Epoxy Resin Composite Dielectric (ERCD) laminate has been made available with thicknesses down to 120µm, Rth=10W/mK, VB≥40kV/mm, Tg≥250°C and bondable to prepeg, Al and Cu boards. The thinness provides better thermal performance than DBC alumina with higher reliability. The laminate is ideal for high temperature applications in cost sensitive applications such as […]
Yoshi will be presenting a joint-paper titled "Reducing the radiation from PCB cavities with a high-DK dielectric layer" at EMC Europe 2020 Virtual to discuss about EMI from PCB cavity with high Dk and ultra-thin embedded capacitance material for higher frequency application such as 5G or mmWave radar.
Prof. David Pommerenke from Graz University will speak about near-field EMI scan technology on 1/12 at 7 am PST. If you are interested in near-field EMI scan technology, please join us. https://site.ieee.org/germany-emc/files/2020/12/ieee_german_emc_chapter_technical_teleconference_Pommerenke_v2.pdf
RISHO and Electronic Interconnect will host a joint PCB technology webinar on March 3 to introduce latest PCB materials and technologies. Here is the agenda of the webinar. 9:30 - 9:35 Kick-off from Rhonda 9:35 - 10:05 RISHO (by Yoshi Fukawa, President of TechDream) RISHO corporate profile Ultra low-loss materials for antenna White-colored and high […]